30 April, 2020

Tungsten Carbide Substrates of Polycrystalline Diamond Cutter

We manufacture highly engineered cemented carbide?substrates for?polycrystalline diamond (PDC) enhanced cutters.

Tungsten carbide(WC) substrate is one of the optimum foundations for mining or machining tool parts coated by a layer of diamond film. We utilize fine or ultra-fine WC powder in fabricating the WC substrate in order to improve the stress distribution and enhance a more nature connectivity degree between TC substrate and PDC skin layer.

Basic Size
DiameterHeight
8.04.5
8.08.0
10.404.5
12.40 ? ??4.5 ? ??
13.334.5
13.335.0
13.44 ? ??8.0 ? ??
15.054.5
15.058.0
16.05 ? ??4.5 ? ??
16.058.0
19.056.5
19.5 ? ? ??8.0 ? ??

unit:mm

By request available

Sintering
HIP.

The advanced computer-controlled HIP furnaces are applied to provide more pressure during the sintering process in order to get denser structure.

Powder
Excellent.

We carefully select and control the excellent quality of our raw powders. Powder spray drying technology ensures the uniformity of distribution of particles.

Processing
In house.

We offer customers a wide array of processing services on-site including centerless grinding, CNC cylindrical grinding, CNC internal grinding, wire EDM, and laser etching, etc.

OEM Custom Service

We can develop grades as per your requirement and make the same shape as your drawing. Laser marking and neutral package are also available for your benefits.

The Grade

Grade Chart
The Application
More Products