{"id":21006,"date":"2022-03-07T01:05:48","date_gmt":"2022-03-07T01:05:48","guid":{"rendered":"https:\/\/www.meetyoucarbide.com\/?p=21006"},"modified":"2022-03-07T01:07:47","modified_gmt":"2022-03-07T01:07:47","slug":"what-is-metal-etching","status":"publish","type":"post","link":"https:\/\/www.meetyoucarbide.com\/tr\/metal-asindirma-nedir\/","title":{"rendered":"Metal a\u015f\u0131nd\u0131rma nedir?"},"content":{"rendered":"
\n

Da\u011flama, nesnelerin y\u00fczeyini i\u015flemek i\u00e7in kimyasal g\u00fc\u00e7l\u00fc asit korozyonu, mekanik cilalama veya elektrokimyasal elektroliz kullanan bir teknolojidir. Esteti\u011fi geli\u015ftirmenin yan\u0131 s\u0131ra nesnelerin katma de\u011ferini de artt\u0131r\u0131r. Geleneksel metal i\u015flemeden y\u00fcksek teknolojili yar\u0131 iletken \u00fcretimine kadar hepsi da\u011flama teknolojisinin uygulama kapsam\u0131 i\u00e7indedir.<\/p>\n\n\n\n

\"\"<\/figure>\n\n\n\n

Metal a\u015f\u0131nd\u0131rma, metal malzemeleri kimyasal reaksiyon veya fiziksel etki yoluyla uzakla\u015ft\u0131rmak i\u00e7in kullan\u0131lan bir teknolojidir. Metal da\u011flama teknolojisi, \u0131slak da\u011flama ve kuru da\u011flama olarak ikiye ayr\u0131labilir. Metal a\u015f\u0131nd\u0131rma, bir dizi kimyasal i\u015flemden olu\u015fur. Farkl\u0131 a\u015f\u0131nd\u0131r\u0131c\u0131lar, farkl\u0131 metal malzemeler i\u00e7in farkl\u0131 korozyon \u00f6zelliklerine ve mukavemetine sahiptir.<\/strong><\/strong><\/p>\n\n\n\n

Fotokimyasal a\u015f\u0131nd\u0131rma olarak da bilinen metal a\u015f\u0131nd\u0131rma, metal a\u015f\u0131nd\u0131rma i\u015fleminde maruz kalma, plaka yapma, geli\u015ftirme ve kimyasal \u00e7\u00f6zelti ile temastan sonra metal a\u015f\u0131nd\u0131rma alan\u0131n\u0131n koruyucu filminin \u00e7\u0131kar\u0131lmas\u0131n\u0131 ifade eder. t\u00fcmsekler veya oyuklar. \u0130lk olarak bak\u0131r levha ve \u00e7inko levha gibi bask\u0131l\u0131 i\u00e7b\u00fckey d\u0131\u015fb\u00fckey levhalar \u00fcretmek i\u00e7in kullan\u0131ld\u0131. G\u00f6sterge panelinin a\u011f\u0131rl\u0131\u011f\u0131n\u0131 azaltmak veya isim levhas\u0131 gibi ince i\u015f par\u00e7alar\u0131n\u0131 i\u015flemek i\u00e7in yayg\u0131n olarak kullan\u0131l\u0131r. Teknoloji ve proses ekipman\u0131n\u0131n s\u00fcrekli iyile\u015ftirilmesi sayesinde, elektronik ince par\u00e7alar\u0131n hassas metal a\u015f\u0131nd\u0131rma \u00fcr\u00fcnlerinin i\u015flenmesi i\u00e7in havac\u0131l\u0131k, makine, kimya end\u00fcstrisi ve yar\u0131 iletken \u00fcretim s\u00fcre\u00e7lerine da\u011flama teknolojisi uygulanm\u0131\u015ft\u0131r.<\/strong><\/strong><\/p>\n\n\n\n

da\u011flama teknolojisi t\u00fcrleri<\/strong><\/strong><\/h2>\n\n\n\n

Islak da\u011flama:<\/strong>\"\"<\/h3>\n\n\n\n

Islak a\u015f\u0131nd\u0131rma, gofreti uygun bir kimyasal \u00e7\u00f6zeltiye dald\u0131rmak veya s\u00f6nd\u00fcrme i\u00e7in kimyasal \u00e7\u00f6zeltiyi gofretin \u00fczerine p\u00fcsk\u00fcrtmek ve elde etmek i\u00e7in \u00e7\u00f6zelti ile a\u015f\u0131nm\u0131\u015f nesne aras\u0131ndaki kimyasal reaksiyon yoluyla filmin y\u00fczeyindeki atomlar\u0131 \u00e7\u0131karmakt\u0131r. da\u011flaman\u0131n amac\u0131 Islak da\u011flama s\u0131ras\u0131nda, \u00e7\u00f6zeltideki reaktanlar \u00f6nce durgun s\u0131n\u0131r tabakas\u0131ndan yay\u0131l\u0131r ve daha sonra kimyasal reaksiyonlar yoluyla \u00e7e\u015fitli \u00fcr\u00fcnler \u00fcretmek i\u00e7in gofret y\u00fczeyine ula\u015f\u0131r. A\u015f\u0131nd\u0131rma kimyasal reaksiyonunun \u00fcr\u00fcnleri, daha sonra s\u0131n\u0131r tabakadan yay\u0131lan ve ana \u00e7\u00f6zeltide \u00e7\u00f6z\u00fcnen s\u0131v\u0131 veya gaz faz\u0131ndaki \u00fcr\u00fcnlerdir. Islak da\u011flama sadece dikey y\u00f6nde de\u011fil, ayn\u0131 zamanda yatay da\u011flama etkisine de sahip olacakt\u0131r.<\/p>\n\n\n\n

Kuru a\u015f\u0131nd\u0131rma:<\/strong>\"\"<\/h3>\n\n\n\n

Kuru a\u015f\u0131nd\u0131rma genellikle plazma a\u015f\u0131nd\u0131rma veya kimyasal a\u015f\u0131nd\u0131rma i\u015flemlerinden biridir. Farkl\u0131 a\u015f\u0131nd\u0131rma etkilerinden dolay\u0131, plazmadaki iyonlar\u0131n fiziksel atomlar\u0131, aktif serbest radikallerin kimyasal reaksiyonu ve cihazlar\u0131n (wafers) y\u00fczey atomlar\u0131 veya ikisinin kombinasyonu a\u015fa\u011f\u0131daki i\u00e7erikleri i\u00e7erir:<\/p>\n\n\n\n

fiziksel da\u011flama: p\u00fcsk\u00fcrtme da\u011flama, iyon \u0131\u015f\u0131n\u0131 da\u011flama<\/p>\n\n\n\n

kimyasal a\u015f\u0131nd\u0131rma: plazma a\u015f\u0131nd\u0131rma<\/p>\n\n\n\n

fizikokimyasal kompozit a\u015f\u0131nd\u0131rma: reaktif iyon a\u015f\u0131nd\u0131rma (RIE)<\/p>\n\n\n\n

Kuru da\u011flama, iyi y\u00f6nl\u00fcl\u00fc\u011fe sahip bir t\u00fcr anizotropik da\u011flamad\u0131r, ancak se\u00e7icilik \u0131slak da\u011flamadan daha k\u00f6t\u00fcd\u00fcr. Plazma a\u015f\u0131nd\u0131rmada plazma k\u0131smen ayr\u0131\u015fm\u0131\u015f bir gazd\u0131r ve gaz molek\u00fclleri elektronlara, iyonlara ve y\u00fcksek kimyasal aktiviteye sahip di\u011fer maddelere ayr\u0131\u015f\u0131r. Kuru da\u011flaman\u0131n en b\u00fcy\u00fck avantaj\u0131 \u201canizotropik da\u011flama\u201dd\u0131r. Ancak kuru da\u011flaman\u0131n se\u00e7icili\u011fi \u0131slak da\u011flamaya g\u00f6re daha d\u00fc\u015f\u00fckt\u00fcr. Bunun nedeni, kuru da\u011flaman\u0131n da\u011flama mekanizmas\u0131n\u0131n fiziksel etkile\u015fim olmas\u0131d\u0131r; Bu nedenle, iyonlar\u0131n etkisi sadece a\u015f\u0131nd\u0131rma filmini de\u011fil, ayn\u0131 zamanda fotorezist maskesini de kald\u0131rabilir.<\/p>\n\n\n\n

\"\"<\/figure>\n\n\n\n

da\u011flama i\u015flemi<\/h2>\n\n\n\n

Metalin t\u00fcr\u00fcne g\u00f6re da\u011flama i\u015flemi farkl\u0131 olacakt\u0131r, ancak genel da\u011flama i\u015flemi a\u015fa\u011f\u0131daki gibidir: metal da\u011flama plakas\u0131 \u2192 temizleme ve ya\u011fdan ar\u0131nd\u0131rma \u2192 suyla y\u0131kama \u2192 kurutma \u2192 film kaplama veya serigraf bask\u0131 m\u00fcrekkebi \u2192 kurutma \u2192 pozlama \u00e7izimi \u2192 geli\u015ftirme \u2192 suyla y\u0131kama ve kurutma \u2192 da\u011flama \u2192 film s\u0131y\u0131rma \u2192 kurutma \u2192 inceleme \u2192 bitmi\u015f \u00fcr\u00fcn ambalaj\u0131.<\/p>\n\n\n\n

1. Metal a\u015f\u0131nd\u0131rma \u00f6ncesi temizleme i\u015flemi:<\/p>\n\n\n\n

Paslanmaz \u00e7elik veya di\u011fer metalleri a\u015f\u0131nd\u0131rmadan \u00f6nceki i\u015flem, esas olarak malzeme y\u00fczeyindeki kir, toz, ya\u011f lekelerini vb. \u00e7\u0131karmak i\u00e7in kullan\u0131lan temizleme i\u015flemidir. Temizleme i\u015flemi, sonraki film veya serigrafi m\u00fcrekkebinin metal y\u00fczeye iyi yap\u0131\u015fmas\u0131n\u0131 sa\u011flaman\u0131n anahtar\u0131d\u0131r. Bu nedenle metal a\u015f\u0131nd\u0131rma y\u00fczeyindeki ya\u011f lekesi ve oksit filmi tamamen \u00e7\u0131kar\u0131lmal\u0131d\u0131r. Ya\u011f alma, i\u015f par\u00e7as\u0131n\u0131n ya\u011f lekesine g\u00f6re belirlenecektir. Ya\u011f giderme etkisini sa\u011flamak i\u00e7in serigraf bask\u0131 m\u00fcrekkebini elektrikli ya\u011f giderme i\u015fleminden \u00f6nce ya\u011fdan ar\u0131nd\u0131rmak en iyisidir. Oksit filme ek olarak, y\u00fczey temizli\u011fini sa\u011flamak i\u00e7in metalin cinsine ve film kal\u0131nl\u0131\u011f\u0131na g\u00f6re en iyi a\u015f\u0131nd\u0131rma sol\u00fcsyonu se\u00e7ilmelidir. Serigrafiden \u00f6nce kuru olmal\u0131d\u0131r. Nem varsa.<\/p>\n\n\n\n

2. Kuru film veya serigraf \u0131\u015f\u0131\u011fa duyarl\u0131 yap\u0131\u015fkan tabaka yap\u0131\u015ft\u0131r\u0131n:<\/p>\n\n\n\n

Ger\u00e7ek \u00fcr\u00fcn malzemesine, kal\u0131nl\u0131\u011f\u0131na ve \u015feklin tam geni\u015fli\u011fine g\u00f6re kuru film veya \u0131slak film serigraf bask\u0131 kullan\u0131lmas\u0131 belirlenir. Farkl\u0131 kal\u0131nl\u0131ktaki \u00fcr\u00fcnler i\u00e7in \u0131\u015f\u0131\u011fa duyarl\u0131 katman uygulan\u0131rken \u00fcr\u00fcn grafikleri i\u00e7in gerekli olan a\u015f\u0131nd\u0131rma i\u015flem s\u00fcresi gibi fakt\u00f6rler g\u00f6z \u00f6n\u00fcnde bulundurulmal\u0131d\u0131r. \u0130yi bir kaplama performans\u0131 ve metal a\u015f\u0131nd\u0131rma ile \u00fcretilen y\u00fcksek desen tan\u0131ml\u0131, daha kal\u0131n veya daha ince \u0131\u015f\u0131\u011fa duyarl\u0131 yap\u0131\u015fkan tabaka olu\u015fturabilir.<\/p>\n\n\n\n

3. Kurutma:<\/p>\n\n\n\n

Film veya rulo serigrafi m\u00fcrekkebinin tamamlanmas\u0131ndan sonra, \u0131\u015f\u0131\u011fa duyarl\u0131 yap\u0131\u015fkan tabakan\u0131n, pozlama i\u015flemine haz\u0131rlanmak i\u00e7in tamamen kurutulmas\u0131 gerekir. Ayn\u0131 zamanda y\u00fczeyin temiz ve yap\u0131\u015fma, kirlilik vb. i\u00e7ermedi\u011finden emin olun.<\/p>\n\n\n\n

4. Maruz kalma:<\/p>\n\n\n\n

Bu i\u015flem \u00f6nemli bir metal a\u015f\u0131nd\u0131rma i\u015flemidir ve maruz kalma enerjisi, \u00fcr\u00fcn malzemesinin kal\u0131nl\u0131\u011f\u0131na ve do\u011frulu\u011funa g\u00f6re de\u011ferlendirilecektir. Bu ayn\u0131 zamanda grav\u00fcr i\u015fletmelerinin teknik yetene\u011finin somutla\u015fm\u0131\u015f halidir. Pozlama s\u00fcreci, da\u011flaman\u0131n daha iyi boyutsal kontrol do\u011frulu\u011fu ve di\u011fer gereksinimleri sa\u011flay\u0131p sa\u011flayamayaca\u011f\u0131n\u0131 belirler.<\/p>\n\n\n\n

5. Geli\u015ftirme:<\/p>\n\n\n\n

Metal a\u015f\u0131nd\u0131rma plakas\u0131n\u0131n y\u00fczeyindeki \u0131\u015f\u0131\u011fa duyarl\u0131 yap\u0131\u015fkan tabaka maruz kald\u0131ktan sonra, desen yap\u0131\u015fkan tabaka maruz kald\u0131ktan sonra k\u00fcrlenir. Daha sonra kal\u0131b\u0131n istenmeyen k\u0131sm\u0131 yani korozyona ihtiyac\u0131 olan k\u0131s\u0131m ortaya \u00e7\u0131kar. Geli\u015ftirme s\u00fcreci, \u00fcr\u00fcn\u00fcn son boyutunun gereksinimleri kar\u015f\u0131lay\u0131p kar\u015f\u0131lamayaca\u011f\u0131n\u0131 da belirler. Bu i\u015flem, \u00fcr\u00fcn \u00fczerindeki gereksiz \u0131\u015f\u0131\u011fa duyarl\u0131 yap\u0131\u015fkan tabakay\u0131 tamamen kald\u0131racakt\u0131r.<\/p>\n\n\n\n

\"\"<\/figure>\n\n\n\n

6. Da\u011flama veya da\u011flama i\u015flemi:<\/p>\n\n\n\n

\u00dcr\u00fcn prefabrikasyon i\u015flemi tamamland\u0131ktan sonra kimyasal \u00e7\u00f6zelti da\u011flanacakt\u0131r. Bu s\u00fcre\u00e7, nihai \u00fcr\u00fcn\u00fcn nitelikli olup olmad\u0131\u011f\u0131n\u0131 belirler. Bu i\u015flem, a\u015f\u0131nd\u0131rma \u00e7\u00f6zeltisi konsantrasyonu, s\u0131cakl\u0131k, bas\u0131n\u00e7, h\u0131z ve di\u011fer parametreleri i\u00e7erir. \u00dcr\u00fcn\u00fcn kalitesi bu parametrelere g\u00f6re belirlenmelidir.<\/p>\n\n\n\n

7. Kald\u0131rma:<\/p>\n\n\n\n

Da\u011flanm\u0131\u015f \u00fcr\u00fcn\u00fcn y\u00fczeyi hala bir \u0131\u015f\u0131\u011fa duyarl\u0131 yap\u0131\u015fkan tabakas\u0131 ile kaplanm\u0131\u015ft\u0131r ve da\u011flanm\u0131\u015f \u00fcr\u00fcn\u00fcn y\u00fczeyindeki \u0131\u015f\u0131\u011fa duyarl\u0131 yap\u0131\u015fkan tabakan\u0131n \u00e7\u0131kar\u0131lmas\u0131 gerekmektedir. I\u015f\u0131\u011fa duyarl\u0131 yap\u0131\u015fkan tabaka asidik oldu\u011fundan, \u00e7o\u011funlukla asit-baz n\u00f6tralizasyon y\u00f6ntemiyle geni\u015fletilir. Ta\u015fma temizleme ve ultrasonik temizlemeden sonra, \u0131\u015f\u0131\u011fa duyarl\u0131 yap\u0131\u015fkan kal\u0131nt\u0131lar\u0131n\u0131 \u00f6nlemek i\u00e7in y\u00fczeydeki \u0131\u015f\u0131\u011fa duyarl\u0131 yap\u0131\u015fkan tabakay\u0131 \u00e7\u0131kar\u0131n.<\/p>\n\n\n\n

8. Testi:<\/p>\n\n\n\n

Film \u00e7ekildikten sonra a\u015fa\u011f\u0131dakiler test edilir, paketlenir ve nihai \u00fcr\u00fcn\u00fcn \u00f6zelliklerini kar\u015f\u0131lay\u0131p kar\u015f\u0131lamad\u0131\u011f\u0131 onaylan\u0131r.<\/p>\n\n\n\n

A\u015f\u0131nd\u0131rma i\u015fleminde al\u0131nacak \u00f6nlemler<\/h2>\n\n\n\n

yan korozyonu ve \u00e7\u0131k\u0131nt\u0131l\u0131 kenarlar\u0131 azalt\u0131n ve metal a\u015f\u0131nd\u0131rma i\u015fleme katsay\u0131s\u0131n\u0131 iyile\u015ftirin: genel olarak, bas\u0131l\u0131 karton metal a\u015f\u0131nd\u0131rma \u00e7\u00f6z\u00fcm\u00fcnde ne kadar uzun olursa, yan a\u015f\u0131nd\u0131rma o kadar ciddi olur. Alttan kesme, bas\u0131l\u0131 telin do\u011frulu\u011funu ciddi \u015fekilde etkiler ve ciddi alttan kesme, ince tel yapmaz. Alttan kesme ve kenar azald\u0131\u011f\u0131nda, a\u015f\u0131nd\u0131rma katsay\u0131s\u0131 artar. Y\u00fcksek da\u011flama katsay\u0131s\u0131, ince \u00e7izginin korunabilece\u011fini ve kaz\u0131nm\u0131\u015f \u00e7izginin orijinal g\u00f6r\u00fcnt\u00fcn\u00fcn boyutuna yak\u0131n oldu\u011funu g\u00f6sterir. Kaplama direnci kalay kur\u015fun ala\u015f\u0131m\u0131, kalay, kalay nikel ala\u015f\u0131m\u0131 veya nikel olsun, a\u015f\u0131r\u0131 \u00e7\u0131k\u0131nt\u0131l\u0131 kenar iletkende k\u0131sa devreye yol a\u00e7acakt\u0131r. \u00c7\u0131k\u0131nt\u0131 yapan kenar\u0131n k\u0131r\u0131lmas\u0131 kolay oldu\u011fu i\u00e7in, iletkenin iki noktas\u0131 aras\u0131nda bir elektrik k\u00f6pr\u00fcs\u00fc olu\u015fur.<\/p>\n\n\n\n

plakalar aras\u0131ndaki a\u015f\u0131nd\u0131rma i\u015fleme h\u0131z\u0131n\u0131n tutarl\u0131l\u0131\u011f\u0131n\u0131 iyile\u015ftirin: s\u00fcrekli plaka a\u015f\u0131nd\u0131rmada, metal a\u015f\u0131nd\u0131rma i\u015fleme h\u0131z\u0131 ne kadar tutarl\u0131 olursa, daha d\u00fczg\u00fcn da\u011flama plakas\u0131 elde edilebilir. \u00d6n da\u011flama i\u015fleminde en iyi da\u011flama durumunu s\u00fcrd\u00fcrmek i\u00e7in, yeniden olu\u015fturmas\u0131 ve telafi etmesi kolay ve da\u011flama oran\u0131n\u0131 kontrol etmesi kolay bir da\u011flama \u00e7\u00f6z\u00fcm\u00fc se\u00e7mek gerekir. Sabit \u00e7al\u0131\u015fma ko\u015fullar\u0131 sa\u011flayabilen ve \u00e7e\u015fitli \u00e7\u00f6z\u00fcm parametrelerini otomatik olarak kontrol edebilen teknolojileri ve ekipmanlar\u0131 se\u00e7in. \u00c7\u00f6z\u00fcnen bak\u0131r miktar\u0131, pH de\u011feri, \u00e7\u00f6zelti konsantrasyonu, s\u0131cakl\u0131k, \u00e7\u00f6zelti ak\u0131\u015f\u0131n\u0131n homojenli\u011fi vb. kontrol edilerek ger\u00e7ekle\u015ftirilebilir.<\/p>\n\n\n\n

t\u00fcm plaka y\u00fczeyinin metal a\u015f\u0131nd\u0131rma i\u015fleme h\u0131z\u0131n\u0131n homojenli\u011fini iyile\u015ftirin: plakan\u0131n \u00fcst ve alt taraflar\u0131n\u0131n ve plaka y\u00fczeyinin her bir par\u00e7as\u0131n\u0131n da\u011flama homojenli\u011fi, metal da\u011flama \u00e7\u00f6zeltisinin ak\u0131\u015f h\u0131z\u0131n\u0131n tekd\u00fczeli\u011fi ile belirlenir. plaka y\u00fczeyi. Da\u011flama i\u015fleminde, \u00fcst ve alt plakalar\u0131n da\u011flama oranlar\u0131 genellikle tutars\u0131zd\u0131r. Alt plaka y\u00fczeyindeki a\u015f\u0131nd\u0131rma oran\u0131, \u00fcst plaka y\u00fczeyinden daha y\u00fcksektir. \u00dcst plakan\u0131n y\u00fczeyinde \u00e7\u00f6zelti birikmesi nedeniyle a\u015f\u0131nd\u0131rma reaksiyonu zay\u0131flar. \u00dcst ve alt plakalar\u0131n d\u00fczensiz da\u011flanmas\u0131, \u00fcst ve alt memelerin enjeksiyon bas\u0131nc\u0131n\u0131 ayarlayarak \u00e7\u00f6z\u00fclebilir. P\u00fcsk\u00fcrtme sistemi ve sal\u0131n\u0131ml\u0131 nozullar, plakan\u0131n merkezinin ve kenar\u0131n\u0131n p\u00fcsk\u00fcrtme bas\u0131nc\u0131n\u0131 farkl\u0131 hale getirerek t\u00fcm y\u00fczeyin homojenli\u011fini daha da iyile\u015ftirebilir.<\/p>\n\n\n\n

Da\u011flama i\u015fleminin avantajlar\u0131<\/h2>\n\n\n\n

\u00c7\u00fcnk\u00fc metal a\u015f\u0131nd\u0131rma i\u015flemi kimyasal \u00e7\u00f6zelti ile a\u015f\u0131nd\u0131r\u0131l\u0131r.<\/p>\n\n\n\n

hammaddelerle y\u00fcksek tutarl\u0131l\u0131\u011f\u0131 koruyun. Malzemenin \u00f6zelliklerini, gerilmesini, sertli\u011fini, \u00e7ekme mukavemetini, akma mukavemetini ve s\u00fcnekli\u011fini de\u011fi\u015ftirmez. Temel i\u015fleme s\u00fcreci, ekipmanda atomize halde kaz\u0131n\u0131r ve y\u00fczeyde belirgin bir bas\u0131n\u00e7 yoktur.<\/p>\n\n\n\n

\u00e7apak yok. \u00dcr\u00fcn i\u015fleme s\u00fcrecinde, t\u00fcm s\u00fcre\u00e7te bask\u0131 kuvveti yoktur ve s\u0131kma, \u00e7arpma ve presleme noktalar\u0131 olmayacakt\u0131r.<\/p>\n\n\n\n

\u00fcr\u00fcn\u00fcn ki\u015fiselle\u015ftirilmi\u015f kal\u0131plama i\u015flemini tamamlamak i\u00e7in i\u015flem sonras\u0131 damgalama ile i\u015fbirli\u011fi yapabilir. As\u0131l\u0131 nokta y\u00f6ntemi, daha uygun maliyetli olan tam plaka elektrokaplama, yap\u0131\u015ft\u0131rma, elektroforez, karartma vb. i\u00e7in kullan\u0131labilir.<\/p>\n\n\n\n

minyat\u00fcrle\u015ftirme ve \u00e7e\u015fitlendirme, k\u0131sa d\u00f6ng\u00fc ve d\u00fc\u015f\u00fck maliyetle de ba\u015fa \u00e7\u0131kabilir.<\/p>\n\n\n\n

A\u015f\u0131nd\u0131rma i\u015fleminin uygulama alan\u0131<\/h2>\n\n\n\n

t\u00fcketici elektroni\u011fi<\/p>\n\n\n\n

filtreleme ve ay\u0131rma teknolojisi<\/p>\n\n\n\n

havac\u0131l\u0131k<\/p>\n\n\n\n

t\u0131bbi malzeme<\/p>\n\n\n\n

hassas makine<\/p>\n\n\n\n

araba<\/p>\n\n\n\n

\u00fcst d\u00fczey el sanatlar\u0131<\/p>\n<\/div>","protected":false},"excerpt":{"rendered":"

Etching is a technology that uses chemical strong acid corrosion, mechanical polishing or electrochemical electrolysis to treat the surface of objects. In addition to enhancing aesthetics, it also increases the added value of objects. From traditional metal processing to high-tech semiconductor manufacturing, they are all within the scope of application of etching technology. Metal etching…<\/p>","protected":false},"author":2,"featured_media":21007,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_jetpack_memberships_contains_paid_content":false,"footnotes":""},"categories":[79,1],"tags":[],"jetpack_featured_media_url":"https:\/\/www.meetyoucarbide.com\/wp-content\/uploads\/2022\/03\/\u56fe\u72473.png","jetpack_sharing_enabled":true,"_links":{"self":[{"href":"https:\/\/www.meetyoucarbide.com\/tr\/wp-json\/wp\/v2\/posts\/21006"}],"collection":[{"href":"https:\/\/www.meetyoucarbide.com\/tr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.meetyoucarbide.com\/tr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.meetyoucarbide.com\/tr\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.meetyoucarbide.com\/tr\/wp-json\/wp\/v2\/comments?post=21006"}],"version-history":[{"count":0,"href":"https:\/\/www.meetyoucarbide.com\/tr\/wp-json\/wp\/v2\/posts\/21006\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.meetyoucarbide.com\/tr\/wp-json\/wp\/v2\/media\/21007"}],"wp:attachment":[{"href":"https:\/\/www.meetyoucarbide.com\/tr\/wp-json\/wp\/v2\/media?parent=21006"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.meetyoucarbide.com\/tr\/wp-json\/wp\/v2\/categories?post=21006"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.meetyoucarbide.com\/tr\/wp-json\/wp\/v2\/tags?post=21006"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}